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FOAM UHS 54/70MM HOOKON PAD

FOAM UHS 54/70MM HOOKON PAD

Specifically designed for the RUPES random orbital polishing system, these resin foam polishing pads produce excellent results with reduced compound consumption. Featuring:
- An innovative "open cell" structure preventing the build-up of heat generated during the polishing process.
- A particle structure guaranteeing max efficiency with minimum downward vertical pressure from the operator.
- A centre hole creating superior ventilation and heat dispersion through special channels in the backing pad.
- An innovative truncated cone shape design which optimises the performance of the large diameter orbit, and at the same time protects against accidental contact between the backing pad and the work surface.
Part Number:
 9.BF70U
Retail Price: $63.51 each (inc GST) Share

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